Lower pixel failure rate: The COB small-pitch LED display does not go through the reflow soldering process, ensuring stable performance and longer lifespan of the LED chips. The cumulative failure rate of the LED chips is less than one-tenth of that of the conventional SMD packaging, allowing for stable operation of the product. Even if maintenance is required, only a single display unit needs to be replaced, which is simple to operate, quick to maintain, and cost-effective.
Better heat dissipation performance: Conventional SMD packaged small-pitch LED displays dissipate heat through four pins, while COB packaged small-pitch LED displays directly attach the light source to the PCB, dissipating heat directly through the PCB board. With a larger heat dissipation area and better heat dissipation, it is conducive to extending the service life of small-pitch displays.
Better consistency: Due to the special packaging method of COB packaging, the screen surface is smooth and flat, with small color differences, good consistency of the displayed picture, and has the advantages of surface waterproofing, dustproofing, and impact resistance.
To sum up, COB small-pitch LED displays outperform conventional displays in many aspects, particularly in terms of high definition, stability and ease of maintenance.
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