Comparation Between COB LED Screen &COB LED Screen

The Differences and Advantages of COB and GOB

COB (Chip on Board) and GOB (Glue on Board) are two distinct LED display packaging technologies, which have significant differences in packaging methods, product specifications, application scenarios, etc. The following are their main differences and advantages: 

Packaging methods

COB: The LED light-emitting chips are directly integrated onto the PCB board and encapsulated by applying epoxy resin on the surface. This method simplifies the packaging process, reduces the use of accessories, and enhances production efficiency and lowers production costs.

GOB: An improvement on SMD technology, it involves adding a layer of transparent protective gel between the LED beads and the PCB board, creating a structure similar to glass encapsulation. This protective material enhances the display's protective performance, such as impact resistance and water resistance.

Product specifications

COB: Suitable for high-density display screens with very small pitches, such as P1.53, P1.25, P0.93, and P0.78. These displays are widely used in stage rental, high-end meeting rooms, command centers, and other scenarios, providing a more detailed and clear visual experience.
GOB: Suitable for medium and large-sized LED displays, mainly targeting products with a pitch of P1.5 and above, such as P1.5 and P1.86. These displays are widely used in commercial advertising, sports venues, outdoor large screens, and other fields, and have gained market favor due to their excellent protective performance. Application scenarios
COB: Mainly applied in the indoor high-density display market, such as stage rental, high-end meeting rooms, command centers, etc., it provides an ultimate visual effect and a slim design.
GOB: Mainly used in scenarios with high protection requirements, such as commercial advertising, sports venues, outdoor large screens, etc., it can operate stably in outdoor or high-humidity environments.
Display effect
COB: By reducing the scattering of light in the packaging material, it significantly enhances color saturation and contrast, making the picture more vivid and the color transition more natural and smooth. The overall brightness is significantly improved, ensuring the picture is clear even in strong light.
GOB: Although it can achieve a frosted effect on the surface through special optical treatment and nano-filling materials to enhance viewing comfort, it is difficult to match the COB technology in terms of pixel density and light efficiency, especially in ultra-small pitch application scenarios, where there are challenges in heat dissipation and stability. Price
COB: The manufacturing cost is relatively high, and the price is usually expensive. Its packaging process is complex, and it is difficult to repair when a fault occurs. The repair may affect the surrounding LED beads .
GOB: Generally, the price is lower than that of COB displays, and it has a relatively high cost performance .

In conclusion, both COB and GOB have their own advantages. Users should choose the appropriate technology based on specific application scenarios and requirements. If the ultimate visual effect and thin design are pursued, COB technology has more advantages; if there are high requirements for protection performance or if it needs to be used in outdoor or high-humidity environments, GOB may be a good choice.